随着微电子器件的精细化与集成化,轻质化、小型化、更高的热导率、与芯片半导体材料(Si、GaAs)相匹配的热膨胀系数成为电子封装材料的发展方向。铝基复合材料将金属的高导热性与陶瓷的低热膨胀性相结合,能满足多种功能特性及设计要求,具有高导热、低膨胀、高刚度、低密度、低成本、制备工艺灵活、基体合金多样化等综合优异性能,是当今电子封装领域的研究热点。本文介绍了以铝为基体的复合电子封装材料的特点,增强体包括碳纤维、Si、SiC、金刚石等,同时介绍了相应的制备方法及应用。<br/>With the refinement and integration of microelectronic devices, lightweight, miniaturization, higher thermal conductivity, thermal expansion coefficient matched with chip semiconductor material (Si, GaAs) turn into the development trend of electronic packaging materials. Assembled with high thermal conductivity of metals and low thermal expansion of ceramics, Al-matrix composites can meet a variety of functional characteristics and design requirements. The materials harbor comprehensive excellent performance as high thermal conductivity, low expansion, high stiffness, low density, low cost, flexible preparation process and matrix alloy diversified, which become a research hotspot in the field of electronic packaging. The characteristics of Al-matrix composites used for electronic packaging are introduced, which the reinforcements include carbon fiber, Si, SiC, diamond, etc. The corresponding preparation method and application are presented simultaneously.
Research Progress and Application of Al-Matrix Composites Used for Electronic Packaging
Qiwen Liang, Chunxuan Liu*, Liuxu Cao, Yang Zhang
Hunan Goldsky Aluminum Industry High-Tech Co., Ltd., Changsha Hunan
Received: Apr. 20th, 2022; accepted: May 13th, 2022; published: May 20th, 2022
ABSTRACT
With the refinement and integration of microelectronic devices, lightweight, miniaturization, higher thermal conductivity, thermal expansion coefficient matched with chip semiconductor material (Si, GaAs) turn into the development trend of electronic packaging materials. Assembled with high thermal conductivity of metals and low thermal expansion of ceramics, Al-matrix composites can meet a variety of functional characteristics and design requirements. The materials harbor comprehensive excellent performance as high thermal conductivity, low expansion, high stiffness, low density, low cost, flexible preparation process and matrix alloy diversified, which become a research hotspot in the field of electronic packaging. The characteristics of Al-matrix composites used for electronic packaging are introduced, which the reinforcements include carbon fiber, Si, SiC, diamond, etc. The corresponding preparation method and application are presented simultaneously.
梁啟文,刘春轩,曹柳絮,张 扬. 铝基复合电子封装材料研究进展及应用Research Progress and Application of Al-Matrix Composites Used for Electronic Packaging[J]. 材料科学, 2022, 12(05): 453-464. https://doi.org/10.12677/MS.2022.125048
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